New miniature applications to be presented by Shellcase at SEMICON West
Shellcase invites you to visit us at booth #15320 at SEMICON West in San
Jose, July 18-20 where we will present several new miniature applications
featuring Shellcase's cutting-edge packaging technology.
Among the innovative products Shellcase will feature at SEMICON West are:
SANYO's World's Smallest CCD Camera Module
- 11.2 mm (width) x 11.2 mm
(height) x 6.7 mm (depth including lens) for cellular telephones. This CCD
sensor utilizes Shellcase's ShellOP WLCSP packaged with a final dimension
of
2.92 x 4.03 mm.
The DELSY® CMOS Sensor
is an
innovative finger print identification module, utilizing the ShellOP wafer
level package with a unique combination of a fiber optic faceplate. The
total CMOS package size is 15.6 x 20 mm.
Leaf C-Most,
an innovative 6.6-mega pixel CMOS-based sensor, represents a breakthrough
in
the area of digital imaging. The C-Most sensor incorporates Shellcase's
ShellOP WLCSP package with a total dimensions of 38 x 25.6 mm. The C-Most
is
a high-end application offering an exceptionally high image transfer rate.
WIZCOM Technology's Stylus Pen
is
designed for the PDA and cellular phone markets and includes an input
device
for scanning and translating text. This device incorporates a ShellOP
WLCSP
package that is 9.6 x 1.3 mm in dimension in its linear sensor.
In the last year, Shellcase has made great strides, raising $20 million in
financing, seeing ShellOP gain greater market acceptance and opening a
production facility as a joint venture in Taiwan. In addition, ShellOP
production is ramping up quickly and can be found in products of well-known
companies, among them: Sanyo, CreoScitex and Given Imaging (the camera in a
pill).
SHELLCASE LOOKS FORWARD TO SEEING YOU AT BOOTH #15320
AT SEMICON WEST IN SAN JOSE, JULY 18-20
About Shellcase
Shellcase is a leading global supplier of innovative wafer level chip size
packaging solutions for semiconductor devices for the growing digital
imaging, data telecommunications and PDA markets. Shellcase has developed
a
proprietary, patented chip-size packaging technology using a wafer-level
process. The company provides contract packaging services and also
licenses
its advances CSP technology, ShellBGA and ShellOP, to IC manufacturers
worldwide. Contract packaging services are provided at the manufacturing
facility in Jerusalem and through a joint venture in Taiwan. Shellcase is
publicly traded on the Canadian Venture Exchange under the symbol SSD. The
company was founded in 1993 and has its headquarters in Jerusalem, Israel
and offices in Silicon Valley.
Contact:
Eric Rosenberg
Marketing Communications Manager
Shellcase LDT.
Phone: +972-2-6798890 Ext. 218
Fax: +972-2-6798850
